AJI Co., Ltd. to exhibit at Semicon Japan, December 3-5. [Booth # 9A-201]
[Exhibits]
- MWC3000
Joining Technologies Including Adhesive, Thermoal and Laser Bonding
- MWC6000
Laser Singulation
Laser-Based Dicing of Glass, Polymer or Sillicon.
- TYPE30
Mirco-Assembly Machinery
Sensor-Based Part Alignment Utilizing Machine Vision and Force Sensing