Toray Engineering Co., Ltd. to exhibit at Semicon Japan, December 3-5. [Booth # 3A-508]
[Exhibition Overview]
Toray Engineering will introduce and demonstrate the latest model of its Wafer Inspection System "INSPECTRA" and the 3-D Non-Contact Surface Profiler (SP) for bumps and MEMS structures. Also, Toray will exhibit the Chip Inspection System (GEN), Water Analyzer, and fine pattern technologies such as PI Etching.
[Exhibits]
Product 1： Wafer Pattern Inspection System INSPECTRA
Product 2： 3-D Non-contact Surface Profiler SP-500/700
Product 3： Wafer Titling System
Product 4： IC Chip Inspection System GEN3000
Product 5： High Precision Oxygen Analyzer, LC-850
Product 6： Polyimide etching Technology